Xa ulungiselela imiboniso ye-LED, ukhetho lwemathiriyeli luchaphazela ngokuthe ngqo ukusebenza kwemveliso, ukuqina, kunye nomboniso wokugqibela. Ukusuka ekukhanyeni-i-chip ekhuphayo ukuya kwizinto zokupakisha, ukusuka kwi-PCB substrate ukuya kwisakhiwo sezindlu, izigqibo zezinto eziphathekayo kwinqanaba ngalinye zifuna uhlolo olubanzi olusekwe kwimeko yesicelo, iimeko zokusingqongileyo, kunye neemfuno zohlahlo lwabiwo-mali. Eli nqaku lihlalutya izinto eziphathekayo zamacandelo angundoqo ukubonelela ngesikhokelo sobuchule kwiimfuno ezilungiselelwe.
IMathiriyeli yesibane sesibane se-LED: Isiseko soMgangatho oLuminous
Amaso esibane se-LED ngundoqo wokukhanya{0}}siqalelo esikhuphayo somboniso, kwaye imathiriyeli yawo ichaphazela ngokuthe ngqo ukuqaqamba, ukuveliswa kombala, kunye nobomi. Okwangoku, isisombululo esiqhelekileyo sisebenzisa i-gallium nitride (GaN){2}{2}}iitshiphusi ezisekwe nge-epoxy okanye i-silicone resin. Kwizinto eziphezulu-ezifana nezikrini zentengiso yangaphandle), amaso esibane ekopolo{5} akhethwayo ngenxa yokuchitha ubushushu obuphezulu phezu kwezibiyeli zentsimbi, ukunciphisa ukubola kokukhanya. Umboniso ocolekileyo wangaphakathi-kwelinye icala, ukholisa ukusebenzisa i-EMC (epoxy molding compound) encapsulation, esebenzisa imathiriyeli ekwaziyo ukumelana nobushushu{8}ukufumana ulawulo oluzinzileyo lwepixel. Ngeemfuno ezizodwa, ezinje nge-ultraviolet okanye usetyenziso lwe-infrared, iintsimbi zesibane ezikhethekileyo ezine-AlGaInP okanye iitshiphusi ezisekwe kwi-InGaN ziyafuneka.
I-PCB Substrate: Ukulinganisa ukuSebenza koMbane kunye nokuchithwa kobushushu
Ukukhethwa kwezinto eziphathekayo kwiibhodi zeesekethe eziprintiweyo (PCBs) kufuneka zilungelelanise ukuhanjiswa kombane kunye ne-thermal conductivity. Iimveliso eziqhelekileyo zihlala zisebenzisa i-FR-4 iibhodi ze-fiberglass (i-flame retardant rating UL94-V0), ilungele iimeko zangaphakathi. Nangona kunjalo, kuxinaniso oluphezulu-lokuphezulu okanye{8}}iziboniso zamandla aphezulu (ezifana nezikrini ezirentwayo kunye nezikrini zesitediyamu), ialuminiyam{11}esekwe kwiPCBs (MCPCBs) okanye iiPCBs zekopolo{13}zinika inzuzo. Ii-substrates zabo zentsimbi zikhupha ngokukhawuleza ubushushu, zithintela ukufudumeza kwendawo kunye nokusilela kwepikseli. Iiprojekthi eziphezulu zide zisebenzise i-ceramic substrates (ezifana ne-aluminium nitride, i-AlN). Nangona zibiza kakhulu, ezi substrates zenza ulungelelwaniso lwesekethe oluchanekileyo ukuya kuthi ga kwinqanaba le-millimeter.
Indawo evalekileyo kunye neSakhiwo esiKhuselayo: ISiqinisekiso esingundoqo sokuguquguquka kokusiNgqongileyo
Izikrini zesiqhelo zangaphandle kufuneka zibe ne-reinforced protection rating (IP65 okanye ngaphezulu). Iindawo ezibiyelweyo zikholisa ukwakhiwa nge-die{2}}i-aluminiyam etyhidiweyo okanye imathiriyeli ye-carbon fibre composite. Eyangaphambili isebenzisa inkqubo edityanisiweyo yokubumba ukuqinisekisa ukomelela kolwakhiwo ngelixa ikwabonelela ngokutshabalalisa ubushushu. Le yokugqibela ilula kwaye ifanelekile kwizicelo zokurenta ezifuna ukudityaniswa rhoqo kunye nokuqhaqha. Ngokuphathelele kunyango lomphezulu, UV{6}}izinto zokugquma ezixhathisayo kunye nokhuseleko lokutshiza kwetyuwa zibalulekile. Ngokukodwa kwiindawo eziselunxwemeni okanye ezinemvula, kucetyiswa ukuba kusetyenziswe isisombululo-sesendlalelo esiphindwe kabini sentsimbi enamalethi kunye nenano{9}}yokugquma ngesitshizi.
Ii-ICs zomqhubi kunye neeCables: Isitshixo esifihliweyo soThutho loMqondiso
Izinto zokupakisha zesekethe edibeneyo yomqhubi (IC) ichaphazela isantya sokuphendula kunye nokuzinza. Ngokomzekelo, i-COB (i-Chip kwiBhodi) iipakethi ezidibeneyo zikhusela ngokuthe ngqo i-chip kunye ne-epoxy resin, ukunciphisa izinga lokungaphumeleli kwe-solder; iipakethe zesiNtu ze-SMD zixhomekeke kubuchule bolawulo lwe-arc obuphezulu-umgangatho weFR{4}}4 substrates. Amandla kunye neentambo zomqondiso kufuneka zisebenzise ioksijini{5}umbindi wobhedu osimahla kunye{7}}nesakhiwo esikhuselayo. Kwiiprojekthi zangaphandle, i-PVC enganyangekiyo kwimozulu okanye i-silicone yerabha yangaphandle iyacetyiswa ukuthintela ukusilela kokugquma okubangelwa kukuguga kwe-UV.
Ukuqukumbela: Ukwenza ngokwezifiso kufuneka kuhambelane neeMfuno zemeko
Material selection isn't a matter of single parameters; it's a systematic process based on factors such as brightness requirements (e.g., >8000 oonomoyi ngaphandle vs.<1000 nits indoors), environmental harshness (temperature, humidity, dust, vibration), and maintenance cycles. We recommend that users communicate in depth with manufacturers during the initial stages of customization, using methods such as finite element analysis (FEA) to simulate thermal distribution and salt spray testing to verify corrosion resistance, to ensure that the final solution achieves optimal performance while maintaining controllable costs.
